- one-sided or two-sided, chemo-mechanical polishing of your provided or new single crystal with a roughness (Ra) <5nm (usually <1nm)
alternatively
- one-sided or double-sided electrolytic polishing
- Polishing of two or more oriented faces (facets) on a crystal surface
- thereby, the macroscopic surface of the crystal can be set by default to
- orientation accuracy < 2° - orientation accuracy < 1° - orientation accuracy < 0.4° - orientation accuracy < 0.1° ( possible up to <0.05°) relative to the crystallographic orientation of the crystal lattice
- Polishing of round surfaces or cylindrical surfaces
- Orientation and cutting of provided crystals with random orientation
- Characterization of crystal mosaicity using gamma diffraction
- Measurement of the roughness (Ra values) of crystal surfaces
- Cutting of crystal geometries according to your specifications with an accuracy of less than +/-0.005 mm, e.g. for fitting single-crystal electrodes in voltammetry
- Drilling with high precision even in oxidic crystals
- Surface etching according to your specifications
- Sensitive welding of a wire for direct electrical contacting of the monocrystals or alternatively
- Growth of bead crystals with up to 50mm long monocrystalline contacting wire
- Attaching of oriented chamfers
- Almost any shape, even of non-conductive (e.g. oxidic or semi-conductive) single crystals: cone geometry, circumferential ring groove, bores, etc.
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